High capacity BGA 132/152 chips have complex pinout
which includes 2 lines of data buses and two groups of 4 CE (Crystal) signals
which are connected separately to the first and the second data bus. This solution guarantees high speed of read/write operations since data can be allocated parallelly (Multi Plane Page Allocation) among crystals via each data bus. Wherefore usually those chips consist of 2 crystals, which are connected to the first and to the second data bus and it is necessary to check each group of crystals.
First data bus with its 4 CE signals is located physically
on the second half of the chip and the second data bus is located in the first half, like on the picture below.
Dumps from the first group of crystals can be read while chip is placed in default orientation in the adapter.
In order to read the dumps from the second group, it is necessary to put the chip in reversed orientation inside the adapter
and switch VSP1,2,3 checkboxes in the reader configuration menu.
If the chip doesn't have connected crystals to the second data bus VNR will not display ID.
Reading dumps from chips Visual inspection of memory chip should precede plugging it to the Reader and adapters. Checking pins and pads is a mandatory process. Bent pins should be adjusted properly. In case of severe damage (e.g. broken pins ...
Guidelines for creating new ticket
DEPENDING ON THE TYPE OF REQUEST FOLLOW GUIDELINES BELOW WHEN CREATING NEW TICKET CASE HELP - GENERAL CHIP-OFF SUBJECT Short description of the problem E.g. ECC doesn't work on PS2251 DESCRIPTION Please provide as much information as possible about ...
LGA - 60 (for TH58TFT1DFKLAVH and alike)
LGA - 60 ADAPTER Recently, we got an interesting request about the Toshiba chip TH58TFT1DFKLAVH from a MacBook motherboard. The chip looked like a standard LGA-60 (for which we have an LGA-52 adapter and it fits), but in fact, it wasn't. Our R&D team ...
Missing data planes in TSOP48, LGA52, BGA132 and BGA152 Sandisk chips.
This article shows the way how to extract all data from TSOP48, LGA52, and BGA132/152 Sandisk memory chips when the configuration and dump size are correct, but half of the dump is still empty. Usually, if a NAND memory chip has 2 or 4 crystals, ...
Why should you throw away your hot air station for unsoldering
There’s one long-lasting debate about memory chip unsoldering – what’s the best technique? Our users constantly ask us about using a hot air station to unsolder memory chips. We'd like to explain in 'simple terms' why using a tool like this can ...