Microsoldering
TSOP chip unsoldering
In this video, we show how to extract a TSOP48 chip from a device. It's important to do this using a soldering iron.
Using hot air can overheat the chip, which may cause significant charge leakage in the NAND. As a result, the dump may contain many bit errors, making the data recovery process much longer or even impossible:
Using hot air can overheat the chip, which may cause significant charge leakage in the NAND. As a result, the dump may contain many bit errors, making the data recovery process much longer or even impossible:
How to extract a monolithic Samsung USB from its metal body
In this video, you'll learn how to safely extract a monolithic Samsung USB drive from its metal casing without causing damage to the internal components. Whether you're preparing for data recovery or simply exploring the internal structure of monolithic USB devices, this tutorial will give you the knowledge and confidence to do it right:
How to remove blue plastic from monolithic USB drive
Modern USB 3.0 monolithic flash drives typically have a blue plastic insert. During a chip-off recovery, it's necessary to remove this plastic layer to gain access to the technological NAND pins. This video demonstrates the first step of such a recovery process:
Coating Layer Removal
In this video, we demonstrate how to remove the coating layer from a microSD card using a fiberglass pen. This step is essential for exposing the technological pads needed for raw dump extraction. The technique shown can also be applied to other monolithic NAND memory devices:
But be careful!
The internal tracks are extremely delicate and can be easily damaged. If that happens, repair is often required in order to create a proper dump and successfully recover the data.
The width of these tracks can be as small as 50 microns. To repair them, you’ll need ultra-fine wire (20–30 microns), a professional-grade micro soldering iron, and most importantly—strong soldering skills.
If you want to avoid this additional work, take extra care when removing the coating layer.
But be careful!
The internal tracks are extremely delicate and can be easily damaged. If that happens, repair is often required in order to create a proper dump and successfully recover the data.
The width of these tracks can be as small as 50 microns. To repair them, you’ll need ultra-fine wire (20–30 microns), a professional-grade micro soldering iron, and most importantly—strong soldering skills.
If you want to avoid this additional work, take extra care when removing the coating layer.
Picture 01. Damaged tracks on a monolithic device.
Picture 02. Repaired tracks after micro soldering.
SanDisk mono USB drive preparation for NAND reading via Rusolut SanDisk monoUFD adapter
In this video, we show how to prepare SanDisk monolithic USB drives for chip-off NAND reading using the SanDisk monoUFD adapter from Rusolut:
Soldering to the technological pads
In this video, we demonstrate how to solder a microSD card to a NAND adapter using its technological pads. This method applies to any monolithic NAND memory card or other device that provides access through technological pads:
Soldering to the VIAs
Sometimes, monolithic NAND memory devices do not have dedicated technological pads under the coating, but instead use VIAs. A VIA consists of two small pads located on different layers of the board, electrically connected through a hole that passes through the PCB. In this video, we demonstrate the soldering process to these VIA pads—commonly referred to as 'soldering to the VIAs':
MicroSD soldering to the second layer
Sometimes, the top layer of a microSD card doesn't provide all the necessary NAND contacts for soldering. In such cases, the missing pins can often be found on the second layer. In this video, we show how to carefully remove part of the top layer of a microSD card—or any other monolithic device—to access the inner tracks for micro soldering:
This is the second part of the video series, demonstrating the process of soldering to the second layer of the microSD card. Part of the upper layer has already been removed, and now we solder wires directly to the exposed tracks on the second layer. In this particular case, only two tracks need to be connected on the second layer:
MicroSD soldering to the second layer
Sometimes, the top layer of a microSD card doesn't provide all the necessary NAND contacts for soldering. In such cases, the missing pins can often be found on the second layer. In this video, we show how to carefully remove part of the top layer of a microSD card—or any other monolithic device—to access the inner tracks for micro soldering:
This is the second part of the video series, demonstrating the process of soldering to the second layer of the microSD card. Part of the upper layer has already been removed, and now we solder wires directly to the exposed tracks on the second layer. In this particular case, only two tracks need to be connected on the second layer:
Thank You for watching!
Rusolut Team
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